Publications

Siva P V Nadimpalli, Ph.D

Refereed Journals

1) Siva P.V. Nadimpalli, Jan K. Spelt, “R-curve behavior of Cu-Sn3.0Ag0.5Cu  solder joints:Eeffect of mode ratio and microstructure”, Vol. 527, 724-734, 2010, Material Science and Engineering A.

2) Siva P.V. Nadimpalli, Jan K. Spelt, “Fracture load prediction of lead free solder joints”, Vol. 77, 3446-61, 2010, Engineering Fracture Mechanics.

3) Siva P.V. Nadimpalli, Jan K. Spelt, “Mixed-mode fracture load prediction of lead free solder joints”, Vol. 78, 317-33, 2011, Engineering Fracture Mechanics.

4) Siva P.V. Nadimpalli, Jan K. Spelt, “Effect of geometry on the fracture behaviour of lead-free solder joints”, June 2010, submitted to Engineering Fracture Mechanics.

5) Siva P.V.Nadimpalli, Jan K.Spelt, “Prediction of solder joint fracture and pad-lift failure in PBGA and CTBGA packages”, submitted to Microelectronics Reliability.

6) N. Siva Prasad Varma, R. Narasimhan.“ A Numerical Study of the effect of loading conditions on tubular hydroforming”, Vol. 196, 174-183, 2008, Journal of Materials Processing and Technology.

7) N. Siva Prasad Varma, R. Narasimhan, Alan Luo, Anil.k.Sachdev. “An analysis of localized necking in aluminium alloy tubes during hydroforming using a continuum damage model”, Vol. 2, 200-209, 2007, International Journal of Mechanical sciences.

International Conferences

1)  Siva P. V. Nadimpalli, Jan K. Spelt, “A geometry and size independent failure criterion for fracture prediction in lead-free solder joints”, presenting at SMTA International Conference on Soldering and Reliability, Toronto, ON, May 18-20, 2010.

2)  Siva P.V. Nadimpalli, Jan K. Spelt, “Predicting  the strength of solder joint using cohesive zone modeling”, presented at SMTA International Conference on Soldering and Reliability, Toronto, ON, May 19-22, 2009.

3)  Siva P.V. Nadimpalli, Jan K. Spelt, “Fracture behavior of a lead-free solder/Cu joint system”, presented at SMTA International Conference on Soldering and Reliability, Toronto, ON, May 13-16, 2008.

Invited Presentations

1)      Advanced Micro Devices Inc. (AMD), Markham, Canada. 26 July 2010.

2)      Celestica Inc. Toronto, Canada. 5 February 2009.

3)      General Motors R&D center, Bangalore, India. 2005.